| 摘要 |
PROBLEM TO BE SOLVED: To provide a light-transmitting epoxy resin composition which gives a cured item excellent in resistances to heat and moisture, low stress properties, and transparency and, when used as an underfill material for optical- communication-type flip chip semiconductor device, can meet requirements for high speed, low loss, and high density more and more increasing in recent years. SOLUTION: This composition essentially comprises (A) an epoxy resin, (B) a cure accelerator, and (C) an inorganic filler and satisfies inequality (1): [ 2(nA2+nC2)-(nA+nC)2}/2]1/2<3.0×10-3 (wherein nA is the refractive index at 25 deg.C of a cured item obtained from the composition not containing ingredient C; and nC is the refractive index at 25 deg.C of ingredient C).
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