| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent a metal pad formed on the main surface of a ceramic multilayer wiring board from being mutually short-circuited via a conductive resin that has flowed out. SOLUTION: Arithmetic average roughness Ra1 on the main surface of the ceramic multilayer wiring board 4 should be 0.01 to 0.1μm, and at the same time arithmetic average roughness Ra2 on the upper surface of a metal pad 5 should be 0.1 to 0.5μm.</p> |
