CAVITY STRUCTURE CIRCUIT SUBSTRATE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an inexpensive and reliable cavity structure circuit substrate that can mount electronic components with high density. SOLUTION: A base substrate 1b for mounting the electronic components is electrically connected and at the same time is mechanically joined to a raised substrate 4a having a space section for forming a connection section to an external circuit and a cavity by an anisotropic conductive film 6. Prior to the junction with the raised substrate 4a, the electronic components are mounted onto the base substrate 1b in advance. A bare chip 2a and a package component 2b are mixedly mounted onto the upper surface of the base substrate 1b, merely the package component 2b is mounted at a cavity side.