| 摘要 |
PROBLEM TO BE SOLVED: To simply and accurately perform modification work of a semiconductor device package, when the semiconductor device package mounted on a circuit board which is a BGA type, etc., is substituted by a new one. SOLUTION: The surfaces of jointing electrodes 23 present on the side of an auxiliary board 20 have been previously welded to a plurality of solder balls 11, provided protrusively on the bottom surface of a semiconductor device package 10. By simply welding to the electrodes of a circuit board solder balls 24 provided protrusively on the rear surfaces of the jointing electrodes 23, the semiconductor device package 10 can be mounted on the circuit board. When substituting a new one for the semiconductor device package 10, the solder balls 11 present on the side of the semiconductor device package 10 are fused by heatings to detach the package 10 therefrom. Thereafter, solder balls 11 of a new semiconductor device package 10A are welded to the joining electrodes 23 present on the side of the auxiliary board 20 to simply and precisely modify the semiconductor device package 10.
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