| 摘要 |
PURPOSE: A semiconductor device is provided to solve the problem that the characteristics of a hard disk itself are greatly affected by temperature increase of an IC for read, write, and amplification, and by greatly decreasing read and write speed. CONSTITUTION: A rear surface of a semiconductor device(16) is exposed onto a back of an insulating resin. A metal plate(23) is stuck onto the rear surface of the semiconductor device(16). The back of the metal plate(23) is essentially flush with the back of a flexible sheet, and can be easily stuck to a second support member(24). Thereby, a heat generated from the semiconductor device is efficiently radiated via the metal plate(23) and second support member(24). |
