| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder paste which lessens the non-melting of the solder paste in reflow and extremely lessens the occurrence of voids and dewetting. SOLUTION: This solder paste is prepared by intimately mixing a powder mixture formed by mixing 10 to 30 vol.% first solder alloy powder composed of 10 to 45mass% Bi and the balance Sn and 70 to 90mass% second solder alloy powder composed of 7 to 11mass% Zn and the balance Sn and a pasty flux. The first solder alloy powder and the second solder alloy powder are so mixed that the composition after melting consisting of 70 to 11mass% Zn, 1 to 5mass% Bi and the balance Sn.
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