| 摘要 |
semiconductor devices for refrigerators, heating units, power supplies, and the like. SUBSTANCE: semiconductor pieces are composite structures built up of at least two parts having contacting and connecting surfaces interconnected through intermediate electricity conducting layers including multilayer structures of antidiffusion, switching, and connecting layers. Contacting surfaces are covered with coats including multilayer ones. At least one of these parts is made of material whose cleavage planes are primarily oriented perpendicular to contacting surfaces. Parts of semiconductor piece may be oriented differently. One of contacting surfaces bears identification marking to facilitate assembly of parts. EFFECT: enhanced efficiency and facilitated manufacture due to enhanced thermoelectric characteristics of semiconductor devices. 10 cl, 6 dwg
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