| 摘要 |
PROBLEM TO BE SOLVED: To provide a flame retardant resin composition which is suitable for a copper-clad laminate used for an electronic circuit load or a sealing material, a molding material, a casting material, an adhesive, an electric insulating coating material used for an electronic component, has excellent thermostability and flame retardancy and is free from a halogenous flame retarder. SOLUTION: The flame retardant resin composition contains (a) a cyanate compound shown by formula (1) (wherein, R1 is -CH2-, -C(CH3)2-, -C(CF3)2-, -CH(CH3)-, -O-, -S-, or direct bond. R2 and R3 are -H, -CH3, -C2H5, or -CF3) and/or a prepolymer made from the same, (b) a multifunctional epoxy resin and (c) a guanidine compound. |
