摘要 |
<p>PROBLEM TO BE SOLVED: To provide a photomask, a semiconductor device, a method for exposing a semiconductor chip pattern, and a chip alignment accuracy inspecting device capable of accurate alignement by eliminating deviations, distortions or the like of a chip array. SOLUTION: When a plurality of semiconductor chip patterns 30 are sequentially arranged adjacent on one water and then exposed, marks 31a, 31b, 31c, and so on for measuring aligning accuracy for measuring positional relation of the adjacent semiconductor chip patterns 30 are provided on the peripheries of the patterns 30. The deviation amount the alignment accuracy of the chip array are measured, based on the superposed positional relation between the adjacent chips of the marks 31a, 31b, and 31c for measuring the alignment accuracy.</p> |