METHOD AND DEVICE FOR FLOW SOLDERING

摘要

PROBLEM TO BE SOLVED: To provide a method which is suitable when a lead-free solder material is used as a solder material as a flow soldering method for mounting an electronic component on a substrate by using the solder material. SOLUTION: By the flow soldering method for mounting the electronic component on the substrate by using the solder material, the fused solder material (4) is supplied to the substrate (11), which is then cooled by using cooling means (12a and 12b) so that the temperature of the substrate (11) falls at a cooling speed of 10 to 100 deg.C/sec.