STACKED SEMICONDUCTOR DEVICE USING CARRIER WITH CHIP SELECT TERMINAL

摘要

PURPOSE: A stacked semiconductor device using a carrier with a chip select terminal is provided to reduce fabricating cost of the carrier, by using the carrier with the chip select terminal of the same type regardless of the order that semiconductor packages are stacked. CONSTITUTION: Leads(120) including a chip select lead(122) are formed in a predetermined number of semiconductor packages(110). Carriers(130a,130b,130c,130d) of a frame type have an upper surface and a lower surface. The upper surface has an inner space corresponding to the semiconductor package. Upper pads(144,154) uniformly disposed with respect to the center of the inner space are formed on the upper surface. Lower pads(156) formed along the vertical axis passing through the respective upper pads are formed on the lower surface, electrically and correspondingly connected to the upper pads. Connection terminals(132) are formed on the respective lower pads, electrically connected to the lower pads. The chip select terminal is composed of a predetermined number of consecutive pairs of respective carriers so that an arbitrary upper pad is electrically connected to its next lower pad with respect to the order that the upper pads are disposed. The chip select lead of each semiconductor chip is electrically connected to the first lower pad of the chip select terminal of the carrier corresponding to the chip select lead. The chip select lead of each semiconductor chip corresponds to one of the chip select terminals of the carrier according to the order that the carriers on which the semiconductor package is mounted are stacked.