| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroplating method for burying a conductor into a minute via hole and a method for manufacturing a wiring board therewith. SOLUTION: The electroplating method for burying the conductor inside the via hole, by electroplating a conducting layer of a thin film as an electrode after forming the conducting layer of a thin film at least in the via hole formed on a predetermined portion of an insulating layer, which has a diameter of 1μm to 100μm, a depth of 1μm to 100μm, and an aspect ratio of 3 or less, while a conductor layer is formed on the other side of the insulating layer beforehand, comprises adjusting the kinematic viscosity of an electroplating liquid for the above electroplating to 1.5×10-6 m2/S, by either adding an additive capable of increasing the viscosity or lowering temperature of the liquid.
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