| 发明名称 |
Method for making holes in a substrate |
| 摘要 |
A method for making holes in a substrate includes steps of cleaning a surface of the substrate and boring the blind holes in the surface of the substrate with laser beams.
|
| 申请公布号 |
US2002070204(A1) |
申请公布日期 |
2002.06.13 |
| 申请号 |
US20000732970 |
申请日期 |
2000.12.08 |
| 申请人 |
COMPEQ MANUFACTURING CO., LTD. |
发明人 |
CHU GUAN-PO;CHENG WEN-CHUNG;HUANG HSIN-R |
| 分类号 |
B08B7/00;B23K26/38;B23K26/42;H01L21/302;H05K3/00;H05K3/26;(IPC1-7):B23K26/38 |
主分类号 |
B08B7/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
