| 摘要 |
PROBLEM TO BE SOLVED: To obtain a liquid epoxy resin composition capable of providing a liquid epoxy resin composition for sealing a semiconductor by screen printing without causing problems of warpage after curing even when a large area such as a wafer mold is sealed and suitably usable for sealing, etc., of a semiconductor device by a printing method. SOLUTION: This liquid epoxy resin composition for sealing the semiconductor is characterized by using an inorganic filler X having <=1 wt.% content of particles having >=45μm maximum particle diameter and 1-10μm average particle diameter and coated with an unreactive organosilicon compound having a reactive functional group and an inorganic filler Y having 0.01-0.1μm average particle diameter and coated with an unreactive organosilicon compound in 0.001-0.1 weight ratio Y/X together as an inorganic filler and compounding the inorganic filler in an amount of 70-90 wt.% based on the whole liquid epoxy resin composition in the liquid epoxy resin composition consisting essentially of (a) a liquid epoxy resin, (b) the inorganic filler and (c) a curing agent.
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