DIE ATTACHMENT PASTE AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a die attachment paste for semiconductor adhesion which has a superior solder cracking resistance. SOLUTION: This die attachment paste consists essentially of (A) hydrocarbon having at least one double bond in one molecule of 500 to 5,000 in number mean molecular weight, (B) a compound which has at least one methacryl group or acryl group in one molecule, (C) a radical polymerizing catalyst, and (D) a filler.