| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method capable of restraining a junction leak from occurring in a PN junction on the side of a chip and reducing the occurrence of dust when a semiconductor device equipped with PN junctions on the side of the chip is manufactured. SOLUTION: When a semiconductor device equipped with PN junctions J on the side of a chip 10 is manufactured, a semiconductor wafer is divided into the chips 10 by annealing their sides 13 with a laser beam 12. |
