发明名称 MOLD FOR MOLDING RESIN AND RESIN MOLDING METHOD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To manufacture a mold using a thin plate at a low cost and to facilitate alteration of a molding cavity. SOLUTION: The mold is constituted of a female mold 1 and a male mold 2, and the molds 1 and 2 are respectively formed by laminating a large number of thin plates 3 and 4. The respective thin plates 3 and 4 are arranged so that the respective plane directions thereof become parallel to mold registering directions C and D, and a molding cavity 7 is formed between the end surfaces 8 and 9 on the side of the molding cavity of them, and the end surfaces 8 and 9 on the side of the molding cavity are covered with flexible plate-shape members 10 and 11. A cooling liquid is injected in the gaps formed between the end surfaces 8 and 9 on he side of the molding cavity and the flexible plate-shape members 10 and 11 to be circulated.
申请公布号 JP2002200619(A) 申请公布日期 2002.07.16
申请号 JP20000401050 申请日期 2000.12.28
申请人 HONDA MOTOR CO LTD 发明人 FUKUDA KOJI;OZAWA SHIGEO
分类号 B29C33/38;B29C45/26;(IPC1-7):B29C33/38 主分类号 B29C33/38
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