发明名称 PROCESSING SYSTEM, PROCESSING METHOD, AND PROGRAM
摘要 PROBLEM TO BE SOLVED: To provide a processing system capable of improving processing reproducibility according to operating conditions of a device, and to provide a processing method and a program.SOLUTION: A control unit 50 of a heat treatment device, comprises: a recipe storage unit 52 which stores processing conditions and application conditions related to device states; a model storage unit 51 which stores processing change models; processing information receiving means for receiving information related to processing results; processing condition identifying means for identifying the processing conditions; processing execution means for executing semiconductor wafer processing according to the identified processing conditions; determining means for determining whether device conditions in the executed processing match application conditions related to the device conditions corresponding to the identified processing conditions; processing condition calculating means for calculating processing conditions close to target processing results on the basis of the executed processing conditions, the processing results obtained as a result of processing the semiconductor wafer under the processing conditions, and the processing change models when the determining means determines that the device conditions in the executed processing match the application conditions related to the device conditions corresponding to the identified processing conditions; and processing condition update means for updating the calculated processing conditions to the identified processing conditions.SELECTED DRAWING: Figure 3
申请公布号 JP2016181626(A) 申请公布日期 2016.10.13
申请号 JP20150061610 申请日期 2015.03.24
申请人 TOKYO ELECTRON LTD 发明人 TAKENAGA YUICHI;YAMAJI KANAME;OTA HIROICHI
分类号 H01L21/31;C23C16/52;H01L21/02;H01L21/22;H01L21/324 主分类号 H01L21/31
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