| 摘要 |
PROBLEM TO BE SOLVED: To provide a board in which thermally/electrically conductive posts with remarkably small variation in shape or dimension is sealed. SOLUTION: A method for manufacturing a build-up core board mainly comprises steps of: 1. bonding a post forming layer (Cu, Cu-based alloy, Fe-Ni- based alloy) on one main surface of a barrier layer (Ni, Ti, Sn, etc.), and a carrier layer on the other main surface, 2. removing a prescribed region so as to reach the barrier layer by etching to form a pattern etching product on which a plurality of thermally/electrically conductive posts are bristled and perforated plate parts made of the same materials are disposed through a hollow part around the posts, laminating prepregs, and thermally pressurizing the product to form a laminate, 3. removing the carrier layer from the laminate, and 4. removing the barrier layer, laminating the prepregs, and thermally pressurizing the product to form a build-up core board. In this case, for a very thin copper foil, a copper foil is preferably made of a composite copper foil having a carrier copper foil layer and an exfoliation layer or a copper foil formed by a transcribing method to improve productivity. |
