| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive particle, an anisotropic conductive adhesive, and a connection structure which are capable of achieving low connection resistance, and high connection reliability, even when used for wiring made of aluminium or the like on which a surface oxide film is readily formed.SOLUTION: The present invention provides a conductive particle 10 obtained by forming a metal layer 12 on the surface of a particle 11 to have a film formed thereon. The Vickers hardness (Hv) of the metal layer 12 is at least 35, but not more than 400. The thickness of the metal layer 12 is at least 5 nm, but not more than 250 nm.SELECTED DRAWING: Figure 1 |
