| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing a bonded substrate, by which defects in the manufacturing of the bonded substrate can be suppressed. SOLUTION: When the pressure in a chamber 71 is at atmospheric pressure, an upper unit 72a and a lower unit 72b atracts a substrates W1 and W2 by vacuum suction, respectively. When the chamber 71 is depressurized, a voltage is applied to respective chuck units 72a and 72b, which electrostatically chuck respective substrates. During the depressurization of the chamber 71 from the atmospheric pressure, the back pressure for attracting substrates W1 and W2 is set equal to the pressure in the chamber 71. This prevents the substrates W1 and W2 from dropping and moving, and suppresses defective bonding of the substrates W1 and W2. |
