| 摘要 |
PROBLEM TO BE SOLVED: To provide a photoelectric circuit board in which an organic optical waveguide is formed on the wiring conductor of an electric circuit board with sufficient adhesion strength. SOLUTION: In the photoelectric circuit board, an organic optical waveguide is formed on the wiring conductor 2 made of a noble metal of the photoelectric circuit board, the organic optical waveguide in which a layer consisting of an organic optical material having a hydroxyl group or an alkyl group is formed as a lower clad layer 4 with a metallic layer 3 consisting of at least one of Ti, Cr, Nb, W, Mo, and T interposed between the conductor 2 and the layer 4. The noble metal of the wiring conductor 2 and the metallic layer 3 are firmly joined by a metallic bond, and the hydroxyl group of the surface terminating end of the metallic layer 3 and the hydroxyl group or alkyl group of a lower clad layer 4 of the optical waveguide are firmly bonded by dehydration polymerization or dealcoholization polymerization in the lower clad layer 4. Thereby, the photoelectric circuit board can be obtained in which the organic optical waveguide is formed with sufficient adhesion strength on the wiring conductor 2 made of a noble metal. |
