SHEET FOR PROTECTING SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To solve problems that a gap is sometimes formed between a circuit and a sheet for fixing a semiconductor wafer or chipping or cracking sometimes occurs during polishing of the semiconductor wafer when the sheet for fixing the semiconductor wafer is laminated onto the semiconductor wafer having unevennesses of about 100μm on the surface thereof. SOLUTION: This sheet for the semiconductor wafer is obtained by providing a cushion layer between a sheetlike support and an adhesive mass layer laminated onto one surface of the support and regulating the dynamic modulus of elasticity of the cushion layer at 10-40 deg.C to 1×10-2 to 5×103 N/cm2, the thickness of the cushion layer to 10-300μm and the thickness of the adhesive mass layer to 5-150μm.