发明名称 METHOD OF FORMING THIN SEMICONDUCTOR FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, DEVICE USED FOR EXECUTING THE METHODS, AND ELECTRO-OPTIC DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a method of forming semiconductor thin film or a method of manufacturing semiconductor device, with which a high-quality polycrystalline semiconductor thin film of polycrystalline silicon, etc., or single-crystal semiconductor thin film can be formed easily and inexpensively in large area at high crystallization rate, and to provide a device which carries out the methods. SOLUTION: At forming of a polycrystalline (or single-crystal) semiconductor thin film 7, such as a large-particle diameter polycrystalline silicon film, etc., on a substrate 1 at high crystallization rate or manufacturing a semiconductor device having the polycrystalline (or single-crystal) semiconductor thin film 7 on the substrate 1 in the method, a low-crystallinity semiconductor thin film 7A is first formed on the substrate 1. Then the polycrystalline (or single-crystal) semiconductor thin film 7 is obtained, by promoting crystallization of the thin film 7A by heating the film 7A to a molten or half-molten state and cooling the thin film 7A to a non-molten state through focused lamp annealing. The device is for executing these methods.</p>
申请公布号 JP2002246310(A) 申请公布日期 2002.08.30
申请号 JP20010036441 申请日期 2001.02.14
申请人 SONY CORP 发明人 YAMANAKA HIDEO;YAMOTO HISAYOSHI
分类号 G02F1/1368;C23C16/44;G09F9/30;H01J9/02;H01L21/00;H01L21/20;H01L21/205;H01L21/26;H01L21/336;H01L21/77;H01L21/84;H01L27/12;H01L29/786;H01L31/04;(IPC1-7):H01L21/20;G02F1/136 主分类号 G02F1/1368
代理机构 代理人
主权项
地址