发明名称 SEMICONDUCTOR AND METHOD FOR MANUFACTURING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a technique capable of reducing a cost for packages by using a common lead frame even when the external shapes of the packages are different. SOLUTION: The technique uses a lead frame 1, including a tab hanging lead part 5a having thin width parts 5a1 and 5a2 . In the case of the first shape, the lead frame is inserted and held, so that the resin introduction holes 9 of mold dies (8a, 8b) correspond to the part 5a1 of the part 5. After firmly sealing resin, the part 5a1 is cut off. In the case of the second shape, the lead frame is inserted and held, so that the resin introduction holes 9 of the mold dies correspond to the part 5a2 of the part 5. After firmly sealing resin, the part 5a2 is cut off. The common lead frame 1 can be used in both of the case of the first shape 254 and the case of the second shape.</p>
申请公布号 JP2002270752(A) 申请公布日期 2002.09.20
申请号 JP20010066237 申请日期 2001.03.09
申请人 HITACHI LTD;HITACHI ULSI SYSTEMS CO LTD 发明人 KAMEOKA AKIHIKO;NOMOTO KAORU;KAWADA YOICHI;ITO FUJIO;SUZUKI HIROMICHI
分类号 H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L23/50
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