| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for a semiconductor-sealing excellent in flowing property on its molding and uniform dispersing property of a filler, having a low water absorption, a high adhesiveness with the semiconductor member and a good curing property on its molding, and excellent in preservation stability in a normal temperature, and a semiconductor device sealed by using the above composition for sealing. SOLUTION: This epoxy resin composition for a semiconductor-sealing containing (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler and (D) a silane coupling agent is characterized by using 82-94 wt.% content of (C) the inorganic filler having 10-25μm mean particle diameter and 2.0-3.5 m<2> /g specific surface area, and (D) the silane coupling agent containing a silane coupling agent (d) expressed by the formula (I) [wherein, R<1> is a >=1C alkyl; R<2> is a >=1C alkyl; and (n) is 0, 1, 2 integer].
|
