PIN INSTALLING RESIN SUBSTRATE, MANUFACTURING METHOD OF PIN INSTALLING RESIN SUBSTRATE, PIN AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a pin installing resin substrate which is difficult to break even if a stress is applied to the pin, a manufacturing method of this pin installing resin substrate, the pin to be used for the pin installing substrate and a manufacturing method of this pin. SOLUTION: The pin installing resin substrate 311 is equipped with a resin substrate 313 having a pin pad 317AP of a diameter 0.9 to 1.1 mm constituted of a resin or the like and exposed to the principal plane 313A and numerous pins 301 jointed with the pin pad 317AP with a solder HD. The pin 301 composed of Kovar has Vickers hardness made to be around Hv=150 by heat treatment to heat up to 700 deg.C beforehand, and has a rod part 301A having a diameter of 0.3 mm and a circular disc-shaped large diameter part 301B formed at one end part of this rod part 301A and having a diameter of 0.60 to 0.70 mm and a thickness of 0.15 to 0.20 mm. This large diameter part 301B is soldered by the pin pad 317AP.