发明名称 Wiring boards, semiconductor devices and their production processes
摘要 A wiring board comprising a substrate having applied on the same side surface thereof one or more terminals for connecting a semiconductor element and one or more terminals for external connection, in which the terminals for connecting the semiconductor element and the terminals for external connection are electrically connected, by a wire, with each other in the interior of the wiring board, and a semiconductor device comprising the wiring board having packaged thereon semiconductor elements. Processes for the production of the wiring board and the semiconductor device are also disclosed.
申请公布号 US6469260(B2) 申请公布日期 2002.10.22
申请号 US20010792991 申请日期 2001.02.24
申请人 SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 HORIUCHI MICHIO;KURIHARA TAKASHI
分类号 H01L23/12;H01L21/48;H01L21/60;H01L21/68;H01L23/13;H01L23/14;H01L23/49;H01L23/498;H05K3/20;(IPC1-7):H01R9/09 主分类号 H01L23/12
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