| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a lead frame that can manufacture a plurality of lead terminals 3, 4, and 5 to a semiconductor device, and a number of electronic components 2 that project from one side of a package body 8 to the semiconductor device using a simply process. SOLUTION: At a site between left and right side frames 11a and at a region between section bars 11b for mutually interlocking both the side frames, a plurality of pairs 6 of first lead terminals for composing one electronic component and a plurality of pairs 6' of second lead terminals for composing one electronic component are aligned so that the pairs face in the opposite direction; at the same time, each of the lead terminals 3', 4', and 5' in each of the pairs 6' of the second lead terminals is positioned among the lead terminals 3, 4, and 5 in the pairs 6 of the first lead terminals; and semiconductor device mounting sections 3a and 3a' in each of the pairs 6 of the first lead terminals and each of the pairs 6' of the second ones are interlocked to the section bars 11b via a narrow piece 11d.</p> |
