| 摘要 |
PURPOSE: To improve the degree of freedom of the drawing around of a wiring, to attain miniaturization and thinning while ensuring a sufficient reliability of connection, and to contribute to the reduction in crosstalk noises or the like in a semiconductor package. CONSTITUTION: The semiconductor package has wiring layers 39 containing wiring patterns and pads formed on insulating base materials or insulating layers 37, protective films 40 formed so as to cover the wiring layers 39 and the insulating base materials or the insulating layers 37 with the exception of the sections of the pads, and external connecting terminals 41 joined with the pads exposed from the protective films 40. The pads, with which each external connecting terminal 41 is joined, are divided into a plurality of pads P1 to P4, and a plurality of the pads are formed at sufficient intervals to an extent that wirings can be passed between the pads. |
