发明名称 POLISHING DEVICE
摘要 PURPOSE: To easily control form of a polishing surface of a surface plate by regulating pressure of fluid flowing between a lower surface of the surface plate and a surface plate receiver. CONSTITUTION: A circumferential edge part of the surface plate 12 is locked by a circularly formed fixed lock member 20 to support the surface plate by the surface plate receiver 14, fluid is provided to flow between the lower surface of the surface plate and the surface plate receiver, and pressure of the fluid is regulated to control form of the polishing surface of the surface plate in this polishing device. A pressing surface of the fixed lock member 20 is set apart from an upper surface of the surface plate 12, an upper surface of the surface plate receiver from the lower surface of the surface plate, and O-rings 22a and 22b are respectively provided on an upper and a lower surfaces of the circumferential edge part of the surface plate 12. An inner circumferential side surface of the fixed lock member 20 and an outer circumferential side surface of the surface plate 12 are set apart from each other as the surface plate is supported by the surface plate receiver 14, and a range surrounded by the lower surface of the surface plate 12, the upper surface of the surface plate receiver 14, and the O-ring 22b communicates with a fluid charging/discharging mechanism.
申请公布号 KR20020083436(A) 申请公布日期 2002.11.02
申请号 KR20020022366 申请日期 2002.04.24
申请人 FUJIKOSHI MACHINERY CORPORATION 发明人 KISHIDA HIROMI;NAKAMURA YOSHIO;ONISHI SUSUMU
分类号 B24B37/04;B24B7/22;B24B37/12;B24B45/00;H01L21/304;(IPC1-7):B24B37/04 主分类号 B24B37/04
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