| 摘要 |
<p>PURPOSE: To provide a semiconductor device which effectively utilizes a process for forming a bonding pads in the semiconductor device having a bonding pads made of an aluminum-based material on a copper wiring, and to provide a manufacturing method thereof. CONSTITUTION: This semiconductor device comprises a substrate (101), copper wiring layers (104, 108, 122, and 124) formed on the upper surface of the substrate (101), aluminum bonding pads (112) formed on the upper surfaces of copper wiring layers (104, 108, 122, and 124) using an aluminum-based material, and an aluminum wiring (126) formed on the upper surfaces of the copper wiring layers (104, 108, 122, and 124) using the same material as the aluminum-based material.</p> |
