METHOD FOR MANUFACTURING WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board in which the thickness of a conductive layer is substantially uniform on the wiring board which has a resin insulation layer; a field via which passes the layer and is formed by filling with plating; and the conductive layer formed thereon by plating. SOLUTION: A method for manufacturing a wiring board comprises: a step of forming a forming electrolytic Cu plating layer 35 with a field via plating agent; a step of thinning the first electrolytic Cu plating layer 35; a step of forming a plating resist layer 41 thereon; the step of forming a second electrolytic Cu plating layer 37 with conformal plating; a step of forming a guard metal layer 45 thereon; a step of removing a plating resist layer 41; the step of removing an unrequired plating layer by etching; and a step of removing a guard metal layer 45.