| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board by which reduction in the rigidity of a board to be discarded is prevented at the time of soldering and its harmful warpage of the soldered parts can be suppressed. SOLUTION: The board 3 to be discarded which is coupled to a product part 2 of the printed board 1 through a coupling part 4 is filled with a conductive members 51 exhibiting a higher degree of elasticity than an insulating substrate 30 when parts are soldered, and is provided with vias 33 in the same construction with vias (not shown in the fig.) mode in the product part 2 as conduction holes which are jointed to conductor foil 31. Accordingly, when the parts are soldered, the rigidity of the board 3 for supporting the printed board 1 is hard to decrease and the warpage of the printed board 1 can be suppressed. |
