发明名称 WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board which is high in adhesive strength and is high in reliability and besides which suppresses fluctuation of characteristic impedance, etc., as to a signal wiring layer. SOLUTION: The wiring board 10 has a signal transmission path of strip line structure where a signal wiring layer 14 is put between the first and second conductor layers 12 and 16 through the first and second insulating layers 13 and 15. The first conductor layer 12 is equipped with a through hole 12B, etc. But, the signal wiring layer 14 is not made in a region corresponding to wiring (a section 12C corresponding to parallel wiring, etc.), made by projecting the signal wiring layer 14 in the thickness direction, but is made in a region not corresponding to the wiring excluding this (a section 12D corresponding to the area between parallel wirings).
申请公布号 JP2002324979(A) 申请公布日期 2002.11.08
申请号 JP20010126273 申请日期 2001.04.24
申请人 NGK SPARK PLUG CO LTD 发明人 NAKANISHI NAOYA
分类号 H05K1/02;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/02
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