| 摘要 |
PROBLEM TO BE SOLVED: To realize a mounting method of high connection reliability that can reduce cost and shorten processing time in respective steps, when mounting flip chips to a circuit board using a solder bump on a semiconductor element. SOLUTION: A resin 4, that starts curing at a lower temperature than the melting temperature of a solder bump 2, is coated on a circuit board 5 or a semiconductor element 1, in advance. In a heat treatment step after positioning of the circuit board 5 and semiconductor element 1, the resin 4 starts curing before the solder is melted. In this case, the cured resin acts as a support for the semiconductor element 1 and prevents it from lowering to the circuit board side due to own weight of the semiconductor. |
