| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a solder circuit board which can realize a finer solder circuit in the method for forming the solder circuit board to form a solder circuit, comprising the steps of reacting an adhesive imparting compound to the surface of a conductive circuit electrode of a printed circuit board to impart adhesion, adhering solder powder to the adhered part, then heating the circuit board, and melting the solder to form the solder circuit; and to provide the solder circuit board which can realize high density mounting of electronic components. SOLUTION: A mean particle size of solder powder is set to a range of D/2 (when the surface of a conductive circuit electrode is convex to the surface of the printed circuit board) to -D/2 (when the surface of the conductive circuit electrode is concave to the surface of the printed circuit board), wherein 7 and 11 are each stepwise differences between the surface of the printed circuit board 4 formed with the conductive circuit electrode and the upper surface of the conductive circuit electrode, and D (μm) is a mean particle size of the solder powder. This structure includes a part in which an interval 15 between the conductive circuit electrode of the printed circuit board and the adjacent conductive circuit electrode is less than 3D.
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