| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a multi-chip module which has through holes in high density and is capable of providing high speed and high reliability. SOLUTION: In a first step, a plurality of fine concave parts are formed to predetermined depths on the rear surface of a silicon substrate to be an opposite side to a mounting surface for a semiconductor chip, and a fine hole having an opening diameter smaller than the fine concave part is formed so as to penetrate the fine concave part from the surface of the silicon substrate to be the mounting surface of the semiconductor chip, thereby forming a through hole. In a second step, an insulating film is formed on both the surfaces of the silicon substrate and inside the through hole, a base conductive layer is formed on the insulating film, and an insulating layer is formed on the base conductive layer exposed in the through hole and on the silicon substrate by using a prescribed insulating pattern as a mask. Thus, the multi-chip module is manufactured.</p> |
