APPARATUS FOR SEALING ELECTRONIC DEVICE AND METHOD FOR SEALING SAME

摘要

PROBLEM TO BE SOLVED: To provide a sealing apparatus which allows implementing an optimum profile for melting solder as well as improving productivity, and a method for sealing the same. SOLUTION: The sealing apparatus comprises a sealing device for superimposing a pre-soldered cap on an opening of a package in which an electronic device is mounted; a multi-clip for collectively receiving and holding a plurality of sets of packages and caps which are superimposed by the sealing apparatus; and a sealing furnace for heating the plurality of sets of packages and caps which are held collectively by the multi-clip to melt the pre-solder and to generate a plurality of electronic devices in which the plurality of sets of packages and caps have been sealed. According to the present invention. since the plurality of sets of packages and caps which are held collectively are heated and sealed, it is possible to increase efficiency of sealing packages and caps.