SUBSTRATE TREATMENT APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus that can execute the removal treatment of reaction products without damaging a metal film, even if a middle rinse process is omitted. SOLUTION: The substrate treatment apparatus has a spin chuck 58 for retaining a substrate W rotatably, a first nozzle 41 for supplying alkaline removing liquid to the substrate W being retained by the spin chuck 58, and a second nozzle 42 for supplying carbonated water to the substrate W which is retained by the spin chuck 58.