| 发明名称 |
RELEASE SHEET FOR SEMICONDUCTOR MOLD |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin release sheet which is mainly used as mold releasing and in which the occurrence of wrinkles is less for a batch mold and a QF N piece mold. SOLUTION: In the release sheet for semiconductor mold, the surface roughness Rz of at least one face is not less than 3.0μm.
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| 申请公布号 |
JP2002359259(A) |
申请公布日期 |
2002.12.13 |
| 申请号 |
JP20010166866 |
申请日期 |
2001.06.01 |
| 申请人 |
HITACHI CHEM CO LTD |
发明人 |
YAMAMOTO OSAMU;HIROSE AKIRA |
| 分类号 |
H01L21/56;(IPC1-7):H01L21/56 |
主分类号 |
H01L21/56 |
| 代理机构 |
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