发明名称 RESIN COMPOSITION FOR HIGH FREQUENCY WELDING AND MOLDING USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a polyolefin resin composition having heat generating characteristic by high frequency wave, giving moldings of excellent transparency, which becomes high frequency weldable by forming a layer on the surface of moldings, and to provide a molding using the resin composition. SOLUTION: This resin composition for high frequency welding comprises a polyolefin resin and a compound having a polar group (e.g. a polymer compound containing a quaternary ammonium salt in the molecule), has a value of the dielectric constant×dielectric dissipation factor (ε×tanη) being 0.01 or more in the measurement of dielectric properties at 23 deg.C and 40 MHz, and has a haze when molded to a film of 200μm thickness being 95% or more of that of the polyolefin resin alone molded at the same molding conditions. The molding is obtained by using the resin composition.
申请公布号 JP2002356587(A) 申请公布日期 2002.12.13
申请号 JP20010162758 申请日期 2001.05.30
申请人 SEKISUI CHEM CO LTD 发明人 TOGAWA KATSUYA;NIKI AKIHIRO
分类号 C08J5/00;C08L23/00;C08L101/02;(IPC1-7):C08L23/00 主分类号 C08J5/00
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