| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component manufacturing device that can further improve the length accuracy of the lead electrodes of electronic components separated from strip type lead frames. SOLUTION: This electronic components manufacturing device comprises a lead frame supply unit 11, which keeps and supplies resin-molded lead frames 1, a lead electrode cutting mechanism 12 separating the electronic parts 2 into individual components 2, and various process treatment mechanisms which perform various process treatment, such as electrical characteristics tests, markings, visual inspections, packagings, etc., on the separated electronic components 2. The device also comprises a plurality of handling unit mechanisms which respectively successively transports the parts 2 to the process units of the various process treatment mechanisms. The lead electrode cutting mechanism 12 cuts the lead electrodes, by pressing a punch 5' having a projection T at its end section against the electrodes from the mounting surface 2b side of the parts 2, while the parts 2 are set with their mounting surfaces 2b facing upward. |
