| 摘要 |
<p>PROBLEM TO BE SOLVED: To overcome such a problem that the bonding strength of a connection pad becomes low since the area of the connection pad becomes remarkably small with the miniaturization and the high function of a wiring board, and that mounting by a socket system becomes difficult when the pad is coated by a coating material for improving bonding strength. SOLUTION: In the wiring board 6, the connection pad 3 which is electrically connected to a wiring conductor 2 is arranged on the surface of an insulating substrate 1 having a wiring conductor 2, and the upper outer peripheral part of the connection pad 3 is coated by the coating material 4 which is integrally fitted to the insulating substrate 1. A plating layer 5 is deposited to the exposed surface of the connection pad 3. When the thickness of the plating layer 5 is set to be (t), and the thickness of the coating material 4 positioned on the upper outer peripheral part of the connection pad 3 to be T, the relation t>=T is set. The head of the surface of the plating layer 5 bonded to the connection pad 3 is exposed from the coating material 4, and the connection pad 3 and the connection terminal of the outer electric circuit board can easily, securely and electrically be connected through the plating layer 5.</p> |
