发明名称 Semiconductor device
摘要 In a SiC substrate (10), a first active region (12) composed of n-type heavily doped layers (12a) and undoped layers (12b), which are alternately stacked, and a second active region (13) composed of p-type heavily doped layers (13a) and undoped layers (13b), which are alternately stacked, are provided upwardly in this order. A Schottky diode (20) and a pMOSFET (30) are provided on the first active region (12). An nMOSFET (40), a capacitor (50), and an inductor (60) are provided on the second active region (13). The Schottky diode (20) and the MOSFETs (30, 40) have a breakdown voltage characteristic and a carrier flow characteristic due to a multilayer structure composed of delta-doped layers and undoped layers and are integrated in a common substrate.
申请公布号 US2003006415(A1) 申请公布日期 2003.01.09
申请号 US20020069654 申请日期 2002.02.26
申请人 YOKOGAWA TOSHIYA;TAKAHASHI KUNIMASA;KITABATAKE MAKOTO;KUSUMOTO OSAMU;UENOYAMA TAKESHI;MIYAZAKI KOJI 发明人 YOKOGAWA TOSHIYA;TAKAHASHI KUNIMASA;KITABATAKE MAKOTO;KUSUMOTO OSAMU;UENOYAMA TAKESHI;MIYAZAKI KOJI
分类号 H01L27/06;H01L29/24;H01L29/36;H01L29/772;H01L29/78;H01L29/872;(IPC1-7):H01L31/031;H01L29/76;H01L21/00 主分类号 H01L27/06
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