Printed wiring board having non-through lead mounting hole and manufacturing method of the same

摘要

A printed wiring board comprises upper and lower copper-clad laminates having circuit patterns thereon, an insulation layer provided between the two laminates, a conductive no-through hole formed on the upper surface of the upper laminate, and a conductive non-through hole formed on lower surface of the lower laminate. The non-through holes on both laminates do not penetrate the insulation layer. The non-through holes can be uses as lead mounting holes for mounting components from both front and back sides of the printed wiring board. High density mounting of insertion component having lead is attained and freedom of circuit design is increased. Manufacturing methods of the printed wiring board having non-through holes are also provided.