| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring board with a built-in element for individually measuring and evaluating each element component which is mounted to the internal layer of a multilayer interconnection board with the built-in element, and to provide the multilayer interconnection board with the built-in element. SOLUTION: The multilayer interconnection board has a core base 1a where a first wiring pattern is formed, an insulating layer 1b that is applied/formed on the core base 1a at a surface side, having the first wiring pattern and has drilled closed-end holes 72 and 82 for connection, at least one built-in element 9b which is formed on the surface of the insulating layer 1b; and a second wiring pattern that is not connected to the built-in element 9b. The first wiring pattern is electrically connected to the second one via the closed-end holes 72 and 82 for connection. The built-in element 9b is not connected electrically or magnetically to any other built-in element at least, and characteristics in the built-in element 9b can be adjusted individually.</p> |
