| 发明名称 | Component-embedded substrate | ||
| 摘要 | A component-embedded substrate having a multilayer substrate formed by laminating a plurality of thermoplastic sheets in a predetermined direction, an internal component provided in the multilayer substrate, and a surface-mount component mounted on a surface of the multilayer substrate using bumps. The surface-mount component, when viewed in a plan view in the predetermined direction, is positioned so as to cross an outline of the internal component, with the bumps on the surface-mount component located 50 μm or more from the outline of the internal component. | ||
| 申请公布号 | US9484397(B2) | 申请公布日期 | 2016.11.01 |
| 申请号 | US201414289938 | 申请日期 | 2014.05.29 |
| 申请人 | MURATA MANUFACTURING CO., LTD. | 发明人 | Gouchi Naoki |
| 分类号 | H01L23/66;H01L49/02;H01L23/00;H05K1/18;H05K3/46 | 主分类号 | H01L23/66 |
| 代理机构 | Pearne & Gordon LLP | 代理人 | Pearne & Gordon LLP |
| 主权项 | 1. A component-embedded substrate comprising: a multilayer substrate formed by laminating a plurality of thermoplastic sheets in a predetermined direction; an internal component provided in the multilayer substrate; and a surface-mount component mounted on a surface of the multilayer substrate using bumps, wherein, the surface-mount component, when viewed in a plan view in the predetermined direction, is positioned so as to cross an outline of the internal component, and all of the bumps on the surface-mount component have a center located 50 μm or more from the outline of the internal component. | ||
| 地址 | Kyoto-Fu JP | ||