| 摘要 |
PROBLEM TO BE SOLVED: To obtain an adhesive composition, which can exhibit reduced permittivity and dielectric dissipation factor in a bonding layer, can hence show improved dielectric properties in the whole including an adherend, and preferably has a good heat resistance and bond strength, and to prepare an adherent sheet prepared by molding the same into a sheet. SOLUTION: There is provided an adhesive composition formed by dispersing a filler in a base material containing an adhesive component, wherein the filler is a porous resin particle, and the relative permittivity at 10 GHz of a resin constituting the porous resin particle is lower than the relative permittivity of the solid component in the base material. |
