发明名称 |
FUNCTION EXPANSION SUBSTRATE, EXPANSION SUBSTRATE FOR COMMUNICATION, INSULATION FILM FOR EXPANSION SUBSTRATE FOR COMMUNICATION, COMPUTER SYSTEM, METHOD FOR REMOVING FUNCTION EXPANSION SUBSTRATE AND SUBSTRATE FOR ELECTRONIC CIRCUIT |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a function expansion substrate that is easily attached and detached to/from a motherboard. SOLUTION: In a CDC(Communication Daughter Card) 70 as a function expansion substrate introduced to the motherboard of a computer system, its surface is covered with an insulation sheet. In the CDC 70, an edge part of one end of the insulation sheet is extended to form a projecting part 95. A user can easily carry the CDC 70 and easily attach and detach the CDC 70 to/from the motherboard by grabbing the projecting part 95.</p> |
申请公布号 |
JP2003044163(A) |
申请公布日期 |
2003.02.14 |
申请号 |
JP20010214379 |
申请日期 |
2001.07.13 |
申请人 |
INTERNATL BUSINESS MACH CORP <IBM> |
发明人 |
FUJII KAZUO;ISHIHARA YOSHIHISA;AARON M STEWART |
分类号 |
G06F1/16;G06F1/18;H01R13/11;H01R13/115;H01R43/02;H05K1/14;H05K3/28;H05K3/30;(IPC1-7):G06F1/16 |
主分类号 |
G06F1/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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